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Ceramic packaging continues to evolve and maintain pace with advancing microelectronics technology, and remains the standard for many applications. High Temperature Co-fired Ceramics (HTCC) are an enabling subset of these technologies, established in the 1960s to provide hermetic, compact, reliable interconnect solutions. Microelectronics are now integrated in nearly every aspect of society, and the performance expectations have intensified. HTCC manufacturing technologies have maintained pace to provide enabling, cost effective solutions for leading-edge technologies including LEDs, power electronics, piezo and optoelectronics, medical advancements, photonics and sensors. Multilayer ceramics continue to be selected to meet miniaturization, heat removal, RF shielding, microwave performance, mechanical stability, high temperature, hermetic, premium reliability standards and cost requirements for emerging technologies.

(2016) Ceramic: Thick and Thin Film. Advancing Microelectronics Magazine: November 2016, Vol. 43, No. 6, pp. 16-19.