The best ceramics
yield the best results.


AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.


Custom HTCC Products
  • Amplifier Housings
  • Ceramic/Metal Packages
  • Crystal/Oscillator/SAW Packages
  • Custom Pin Grid Arrays (PGA)
  • High Frequency Feedthroughs
  • Hybrid Packages
  • Leadless Chip Carriers (CLCC)
  • Multichip Modules (MCM)
  • Optical Packages
  • Pad Array Carriers (BGA)
  • Power Dissipation Packages
  • Quad Flatpacks (QFP)
  • Quad No Lead (QFN)
  • Sensor Packages
Crystal/Oscillator/SAW Packages
AdTech Ceramics manufactures custom designed packages specifically for crystal/oscillator/SAW frequency control devices.
Optoelectronic Packages
We offer custom-designed ceramic packages for CMOS, CCD, infrared and ultraviolet image sensors. The rigidity and high strength of our ceramic materials systems make them perfect for a range of image sensor applications.
Hermetic/High Frequency Feedthroughs
AdTech Ceramics specializes in hermetic ceramic feedthroughs for DC to Ka band applications. AdTech's patented "split-via" concept provides an exceptionally reliable method of edge metallization without concern for processing damage at the point where metallization wraps around the edges.
Ball/Pad Grid Arrays
In addition to standard Ball/ Pad grid array layouts, AdTech Ceramics can co-fire refractory metal bumps on BGAs that will retain their shape through multiple solder reflow operations.
Ceramic/Metal Packages
AdTech Ceramics' extensive experience with metal machining combined with multi-layer co-fire ceramics brazing technology provides an avenue for complex hermetic packaging applications. Ceramic/metal housings provide superior I/O density, electrical functionality and superior mechanical robustness over glass/metal seal technologies.
Microwave Packages
AdTech produces HTCC and AlN packages for microwave applications in the L through Ka band frequency ranges. Design assistance utilizes state of the art 3-D Finite Element Method (FEM) simulators and proprietary numerical simulators.
Pin Grid Arrays (PGA)
Custom Ceramic Pin Grid Array packaging for semiconductor microprocessors as well as high temperature, optoelectronic and multichip modules applications.
Multichip Modules
Utilizing multi-layer co-fired ceramics and metal components, AdTech Ceramics specializes in manufacturing custom Multichip Modules in a variety of hermetic package configurations.
Alumina Substrates with Hermetic Vias
AdTech Ceramics' proprietary 92% alumina formulation allow for hermetic straight through vias. Surface finished can be polished to .000005" (.127um) commonly used for thin/thick film substrate.
Power Dissipation Packages
AdTech Ceramics' HTCC has a higher thermal conductivity than organic PWB's or LTCC. High thermally conductive materials such as BeO and CuW can be brazed to HTCC packaging as heat sinks.
Leadless Chip Carriers (LCC)
Our custom-made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance.
Optical Packages
HTCC is a practical choice or optical applications packages due to hermeticity, flatness capability and stable over a wide temperature range.
High Lead Count Packages
With in-house chemical milling and punching capabilities, AdTech offers lead pitch to 0.020" centerlines.
Advantages of HTCC Packages
  • Cost-Effective
  • Design Flexibility
  • Environmental Resistance
  • Hermeticity
  • Mechanical Rigidity
  • Resistance to Mechanical and Thermal Shock
  • Surface Flatness
  • Thermal Dissipation
Industries Served
  • High Frequency/High Temperature Electronics
  • High Reliability Industrial/Commercial
  • Information
  • Medical
  • Military
  • Optoelectronics
  • Telecommunications
  • DFARS 252.225-7014 (Alternate 1) Compliant
  • ISO 9001:2008 Certified
  • AS9100C Certified
  • ITAR Compliant
  • MIL-I-45208
  • RoHS Directive Compliant

Material Properties & Specifications

white or dark alumina
3.62 g/cc (0.131 #/cu. in.)
1207 (Knoop) kg/mm 2
Flexural Strength
443 MPa (64 psi x 10 3 )
Youngs Modulus
275 GPa (40 psi x 10 6 )
Shear Modulus
112 GPa (16 psi x 10 6 )
Surface Finish
<1.14 µm (<45 µ")
Thermal Expansion (25-300°C)
6.57 10 -6 /ºC (3.64 10 -6 /ºF)
Thermal Expansion (25-500°C)
7.16 10 -6 /ºC (3.98 10 -6 /ºF)
Metallization Resistances
Buried: 0.012 ohm/sq (Standard) Surface: 0.005 ohm/sq (Gold Plated) Vias: 0.003 ohm (0.25mm (.010") DIA x 0.25mm (.010") length) 0.008 ohm /sq (High Conductivity)
Firing Temperature
Brazed Component Materials
  • Alloy 194
  • Alloy 42
  • Copper Alloy
  • Copper Tungsten
  • Kovar
  • Molybdenum


Types of Plating
  • Electoless Gold per AMS 2422
  • Electroless Nickel per AMS 2404
  • Electrolytic Gold per AMS 2422
  • Electrolytic Nickel per AMS 2403
Gold Electroless Standards Met
Meets MIL-G-45204 or AMS2422
Gold Electrolytic Standards Met
MIL-G-45204 or AMS2422
Nickel Electroless Standards Met
Nickel Electrolytic Standards Met
Electrolytic and Electroless Nickel Plating
50µ" TO 250µ"
Electrolytic and Electroless Gold Plating Thickness
1µ" to 100µ"