PLATINUM (HTCC)
AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.
TYPICAL PACKAGE CONFIGURATIONS
- Custom HTCC Products
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- Amplifier Housings
- Ceramic/Metal Packages
- Crystal/Oscillator/SAW Packages
- Custom Pin Grid Arrays (PGA)
- High Frequency Feedthroughs
- Hybrid Packages
- Leadless Chip Carriers (CLCC)
- Multichip Modules (MCM)
- Optical Packages
- Pad Array Carriers (BGA)
- Power Dissipation Packages
- Quad Flatpacks (QFP)
- Quad No Lead (QFN)
- Sensor Packages
- Crystal/Oscillator/SAW Packages
- AdTech Ceramics manufactures custom designed packages specifically for crystal/oscillator/SAW frequency control devices.
- Optoelectronic Packages
- We offer custom-designed ceramic packages for CMOS, CCD, infrared and ultraviolet image sensors. The rigidity and high strength of our ceramic materials systems make them perfect for a range of image sensor applications.
- Hermetic/High Frequency Feedthroughs
- AdTech Ceramics specializes in hermetic ceramic feedthroughs for DC to Ka band applications. AdTech's patented "split-via" concept provides an exceptionally reliable method of edge metallization without concern for processing damage at the point where metallization wraps around the edges.
- Ball/Pad Grid Arrays
- In addition to standard Ball/ Pad grid array layouts, AdTech Ceramics can co-fire refractory metal bumps on BGAs that will retain their shape through multiple solder reflow operations.
- Ceramic/Metal Packages
- AdTech Ceramics' extensive experience with metal machining combined with multi-layer co-fire ceramics brazing technology provides an avenue for complex hermetic packaging applications. Ceramic/metal housings provide superior I/O density, electrical functionality and superior mechanical robustness over glass/metal seal technologies.
- Microwave Packages
- AdTech produces HTCC and AlN packages for microwave applications in the L through Ka band frequency ranges. Design assistance utilizes state of the art 3-D Finite Element Method (FEM) simulators and proprietary numerical simulators.
- Pin Grid Arrays (PGA)
- Custom Ceramic Pin Grid Array packaging for semiconductor microprocessors as well as high temperature, optoelectronic and multichip modules applications.
- Multichip Modules
- Utilizing multi-layer co-fired ceramics and metal components, AdTech Ceramics specializes in manufacturing custom Multichip Modules in a variety of hermetic package configurations.
- Alumina Substrates with Hermetic Vias
- AdTech Ceramics' proprietary 92% alumina formulation allow for hermetic straight through vias. Surface finished can be polished to .000005" (.127um) commonly used for thin/thick film substrate.
- Power Dissipation Packages
- AdTech Ceramics' HTCC has a higher thermal conductivity than organic PWB's or LTCC. High thermally conductive materials such as BeO and CuW can be brazed to HTCC packaging as heat sinks.
- Leadless Chip Carriers (LCC)
- Our custom-made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance.
- Optical Packages
- HTCC is a practical choice or optical applications packages due to hermeticity, flatness capability and stable over a wide temperature range.
- High Lead Count Packages
- With in-house chemical milling and punching capabilities, AdTech offers lead pitch to 0.020" centerlines.
- Advantages of HTCC Packages
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- Cost-Effective
- Design Flexibility
- Environmental Resistance
- Hermeticity
- Mechanical Rigidity
- Resistance to Mechanical and Thermal Shock
- Surface Flatness
- Thermal Dissipation
- Industries Served
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- High Frequency/High Temperature Electronics
- High Reliability Industrial/Commercial
- Information
- Medical
- Military
- Optoelectronics
- Telecommunications
- Certifications
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- DFARS 252.225-7014 (Alternate 1) Compliant
- ISO 9001:2008 Certified
- AS9100C Certified
- ITAR Compliant
- MIL-I-45208
- RoHS Directive Compliant
Material Properties & Specifications
- Color
- white or dark alumina
- Density
- 3.62 g/cc (0.131 #/cu. in.)
- Hardness
- 1207 (Knoop) kg/mm 2
- Flexural Strength
- 443 MPa (64 psi x 10 3 )
- Youngs Modulus
- 275 GPa (40 psi x 10 6 )
- Shear Modulus
- 112 GPa (16 psi x 10 6 )
- Surface Finish
- <1.14 µm (<45 µ")
- Thermal Expansion (25-300°C)
- 6.57 10 -6 /ºC (3.64 10 -6 /ºF)
- Thermal Expansion (25-500°C)
- 7.16 10 -6 /ºC (3.98 10 -6 /ºF)
- Firing Temperature
- 1600°C
- Brazed Component Materials
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- Alloy 194
- Alloy 42
- Copper Alloy
- Copper Tungsten
- Kovar
- Molybdenum
PLATING SPECIFICATIONS
- Types of Plating
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- Electoless Gold per AMS 2422
- Electroless Nickel per AMS 2404
- Electrolytic Gold per AMS 2422
- Electrolytic Nickel per AMS 2403
- Gold Electroless Standards Met
- Meets MIL-G-45204 or AMS2422
- Gold Electrolytic Standards Met
- MIL-G-45204 or AMS2422
- Nickel Electroless Standards Met
- AMS2404
- Nickel Electrolytic Standards Met
- SAE AMS-QQ-N-290
- Electrolytic and Electroless Nickel Plating
- 50µ" TO 250µ"
- Electrolytic and Electroless Gold Plating Thickness
- 1µ" to 100µ"